Valley Design specializes in precision lapping, polishing, dicing, grinding and other precision machining of a wide variety of materials. From Valley Design we can offer high-quality micro-electronic, electro-optical and optical products such as windows, wafers, substrates, shims and other flat components. They specialize in ultra-thin (<25 μm), ultra-flat (1/10 wave), super polishing (<5 Ångström) and tight tolerances (+/- 0.5 μm) of all types of materials.
Valley Design can slice or dice parts as small as 0.12 mm square out of 6" x 18" rectangular or 6" diameter substrates on state-of-the-art computerized dicing saws. They perform dicing on many materials including difficult materials such as sapphire, fragile crystals, thick and thin glass, quartz and various metals.
To drill holes in hard, brittle materials, Valley Design uses ultrasonic rotary drilling: a precision hole drilling service that produces stress free holes devoid of microscopic cracks or fissures usually caused by heat from conventional rotary drilling or laser cutting. Ultrasonic hole diameters from 0.5 mm to 12 mm are available and conventional diamond drill hole diameters as small as 0.2 mm up to a depth of 25 mm. After drilling the holes may be lapped, polished or shaped as needed.